Top-ported MEMS microphones are among the most common form factors for voice and audio capture in smartphones, tablets, and smart home devices. In a top-ported design, the acoustic inlet is located on the package’s top surface, allowing sound to directly reach the MEMS diaphragm without additional PCB routing. Below, we explore their benefits, design tips, and typical use cases.

How Top-Ported MEMS Microphones Work
A top-ported MEMS microphone features an opening on the package’s top side. Incoming sound waves enter directly through this port, striking the silicon diaphragm inside. The diaphragm’s motion is converted to an electrical signal via capacitive or piezo-resistive sensing, then digitized on-chip into PDM or I²S output.
Key Advantages
- Direct Sound Path
– Minimizes acoustic damping and resonance variations caused by PCB vias or cavities. - Simplified PCB Layout
– No need for a board cutout or via; the microphone mounts flush on the surface. - Consistent Frequency Response
– Uniform acoustic inlet geometry leads to predictable performance across assemblies.
Design Considerations
- Acoustic Port Protection
Use a small grille or mesh to prevent dust ingress without blocking sound. - Placement Relative to Enclosure
Ensure the port isn’t obstructed by housing features or components. - Sealing & Conformal Coating
Apply targeted coatings that don’t cover the port; consider water-resistant variants for IP-rated devices.
Common Applications
- Smartphones & Tablets
Top-ported mics deliver consistent call quality and noise cancellation performance. - Smart Speakers & Voice Assistants
Direct porting enhances far-field voice pickup. - Industrial & Medical Devices
Reliable operation in environments where precise acoustic sensing is critical.
SISTC Top-Ported MEMS Microphone Options
Explore SISTC’s full digital MEMS microphone lineup—including top-ported models—on our MEMS Microphone Category Page. Our offerings feature:
- High SNR (up to 64 dB) for clear audio capture
- AOP up to 130 dB SPL to handle loud environments
- PDM & I²S digital outputs for seamless integration
Further Reading
- TDK InvenSense MEMS Microphone Packaging Guide
https://www.invensense.tdk.com/technology/mems-microphones/packaging - Analog Devices Acoustic Design for MEMS Microphones
https://www.analog.com/en/technical-articles/acoustic-design-for-mems-microphones.html