About SISTC
Established in 2009, Wuxi Silicon Source Technology Co., Ltd. (SISTC) is a leading China-based provider of AI audio front-end solutions. We specialize in integrating high‑performance MEMS microphone technology with intelligent voice interface systems.
With 15+ years of expertise, SISTC provides comprehensive AI audio reference designs. Our core competencies include high-SNR MEMS microphones, DSP beamforming, noise reduction, Sound Source Localization (SSL), and Acoustic Echo Cancellation (AEC). We ensure seamless hardware-software integration across Android, Linux, ESP32, and various embedded platforms via USB, UART, and I2S interfaces.




AI Audio Front-End Solutions for Next-Generation Voice Devices
High‑Performance MEMS Microphones • Beamforming • Low‑Power Voice Capture
Empowering next‑generation AI devices with clean, accurate, and reliable audio input.
Our MEMS microphones deliver high SNR, low noise, and ultra‑low power performance for mobile, wearable, and IoT applications.
⭐ Core Capabilities
AI‑Optimized Audio Front-End for voice assistants, LLM devices, and smart hardware
Far‑Field Voice Pickup & Beamforming for clear speech in noisy environments
OEM‑Ready MEMS Microphones & Arrays with stable supply and engineering support
Smartphones
Tablets
Wearable Devices
Smart Home Devices
Hearing Aids
Automotive Electronics
Medical Equipment
Consumer Electronics
Security Systems
FEATURED CATEGORIES
FEATURED PRODUCTS
- Analog MEMS microphone
Analog MEMS Microphone
- Digital MEMS microphone
Digital MEMS Microphone
R&D Excellence
Self‑Developed MEMS & ASIC Dies
We independently design and develop MEMS and ASIC dies, with over 150 million units shipped worldwide—demonstrating proven reliability and large‑scale manufacturing capability.
Advanced Acoustic Simulation & Debugging
Our engineering team leverages Creo and COMSOL Multiphysics to deliver customized structural and acoustic simulations, enabling precise optimization for customer‑specific acoustic performance requirements.
Strong Product Innovation Capability
We pioneered several industry‑first innovations, including the Directional MIC, Button MIC, Bone‑Conduction MIC, and high blow‑resistance MEMS microphones, setting new benchmarks in acoustic sensing technology.
Professional Engineering Team
Our R&D team includes 25 professional acoustic and structural engineers, with more than half having 5+ years of independent product development experience, ensuring strong technical execution and rapid project delivery.











