English 
Chinese In the rapidly evolving landscape of audio technology, the collaboration between XMOS and SISTC is setting new standards for immersive, high-performance audio solutions. As a proud partner of XMOS, SISTC brings its expertise in MEMS sensor technology to complement XMOS’ advanced networked audio platforms, delivering integrated solutions that redefine clarity, efficiency, and scalability for global industries.
Unleash the Power of 3D Audio with XMOS & SISTC
XMOS’ innovative solutions, such as the AES67-compliant Ethernet audio development board, empower devices with low-latency, high-precision audio transmission—ideal for public address systems, background music setups, and intercom applications in retail, industrial, and transportation sectors. This board, featuring real-time audio DSP processing and support for 30W speaker amplification, forms the backbone of seamless networked audio systems.
Paired with SISTC’s cutting-edge MEMS microphones, the synergy becomes unstoppable. Our high-precision digital and analog MEMS microphones (e.g., Digital MEMS MIC and Analog MEMS MIC) offer:
- Exceptional sensitivity and noise rejection for crystal-clear voice capture in challenging environments.
- Compact design perfect for space-constrained devices like smartphones, wearables, and industrial sensors.
- Reliability validated for mass-market applications, from consumer electronics to smart infrastructure.
Key Features & Benefits for Your Business
- Advanced Audio Processing Meets MEMS Precision
XMOS’ xCORE processor integrates network protocols, real-time audio processing, and AI-driven noise cancellation (via deep neural networks), while SISTC’s MEMS microphones ensure pristine sound input. Together, they enable:- Echo cancellation and directional sound capture for intercoms and remote monitoring systems.
- Seamless compatibility with AES67, simplifying integration of diverse audio devices.
- Scalable Solutions for Diverse Industries
Whether you’re developing:- Smart home devices requiring immersive spatial audio.
- Industrial monitoring systems needing robust acoustic sensing.
- Public transport intercoms demanding low-latency communication.
SISTC’s MEMS microphones and XMOS’ audio platforms deliver unmatched performance at scale.
- Cost-Effective & Energy-Efficient Design
XMOS’ unified chip architecture reduces complexity and power consumption, while SISTC’s MEMS technology ensures high-quality sensing at competitive costs—ideal for mass production.
Why Partner with SISTC as Your MEMS Provider?
As an authorized partner of XMOS, SISTC offers:
- Tailored integration support for XMOS’ audio development kits, ensuring smooth deployment of MEMS microphones.
- Comprehensive product range including digital and analog MEMS microphones, suitable for diverse audio applications.
- Global market expertise with solutions already adopted in Europe and ready for expansion in China (XMOS plans to open local support in H2 2025).
Explore Our Solutions Today
Ready to transform your audio products with cutting-edge MEMS technology and networked audio capabilities?
- Visit sistc.com/product-category/mems-microphone/ to discover SISTC’s MEMS microphone portfolio.
- Contact us at info@sistc.com for technical support, partnership inquiries, or to discuss custom solutions for your business.
Join the revolution in smart audio—where XMOS’ innovation meets SISTC’s precision. Elevate your devices with sound that stands out in any environment.
