High-Resolution 176-MEMS Microphone Array: ASAI176 Acoustic Imaging Module for Sound Source Localization

High-Resolution 176-MEMS Microphone Array: ASAI176 Acoustic Imaging Module for Sound Source Localization

Overview

The ASAI176 Acoustic Imaging Array Module is a dedicated acoustic front-end solution designed for the development of portable and embedded acoustic imaging systems.
With 176 high-performance MEMS microphones and integrated beamforming and noise localization algorithms, this module enables real-time sound source localization and visualization.
It provides a complete foundation for OEMs and developers to build customized acoustic cameras and sound diagnostics equipment.

Key Features

  • 176-Mic MEMS Array for high-precision sound capture

  • Integrated Beamforming and Noise Localization Algorithms

  • Support for Secondary Development with open interfaces and SDK documentation

  • Compact and Modular Design for easy system integration

  • Wide Frequency Range: Up to 90 kHz, 24-bit resolution

  • Standard Interfaces: Ethernet, USB, audio, and power connectors

  • Compatible with Portable, Embedded, or Industrial Acoustic Imaging Devices


Technical Specifications

ParameterSpecification
ModelASAI176
Microphones176 MEMS microphones
Sampling Rate200 kHz
Frequency RangeUp to 90 kHz
Sound Pressure Level (SPL)Max. 120 dB
Dynamic Range40 dB
Resolution24-bit
Optical Sensor Support1280 × 800 px @ 40 FPS
Acoustic Frame RateUp to 100 FPS
Interface OptionsEthernet / USB-A 3.0 / USB-C / Audio 3.5mm
Power Supply20 V via USB-C
Dimensions340 × 340 × 100 mm
Weight2.6 kg
Ingress ProtectionIP54
Recommended UsePortable or Embedded Acoustic Imaging Systems

Applications

  • Portable acoustic imaging instruments

  • Industrial equipment noise diagnostics

  • Structural vibration and leakage detection

  • Embedded sound source localization systems

  • R&D and academic acoustic research


Development & Integration Support

  • Provides hardware documentation and SDK interface

  • Supports custom algorithm integration

  • Compatible with third-party computing platforms

  • Designed for OEMs, integrators, and acoustic system developers

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