Customizable MEMS MIC Collaboration Models for Wearable Electronics

Company News /

Our goal is to let customers focus on their AI algorithms – we handle the mic front end,” says Dr. Li, R&D Director at Wuxi Silicon Source Technology Co., Ltd., a leading MEMS microphone supplier.

Model 1 – Customer-Provided ASIC + MEMS MIC Integration

Why ASIC Integration?

  • Seamless IP integration: Customers bring proprietary voice-AI DSPs or codecs; Silicon Source pairs them with MEMS MIC dies (e.g., SMI821, SMI861). This lets partners leverage their unique algorithms while offloading MEMS packaging and testing to experts2[turn0search2].
  • Compact package: Flip-chip bonding ASIC & MEMS die on HTCC substrate delivers minimal 3 × 4 mm footprint2[turn0search2].
  • High performance: Achieves up to 70 dB SNR and 132 dB SPL AOP, preserving vocal nuances even in noisy gym or outdoor environments3[turn0search1].
  • Low power draw: Typical active current <1 mA; standby <5 µA supports always-listening wake-word features on battery-powered headsets4[turn0search4].

“Integration of ASIC and MEMS on a shared substrate shortens signal paths and boosts reliability,” notes Dr. Li, referencing best practices from Nature’s review on MEMS/IC integration5[turn0search7].

Model 2 – Full-Stack OEM MEMS MIC Customization

Turnkey Design Process

  1. Requirement Definition: Partners specify sensitivity, power, package, and interface (PDM or I²S).
  2. Diaphragm & Port Engineering: Custom diaphragm geometry and acoustic port tuning optimize frequency response for wearables6[turn0search19].
  3. Wafer-Scale Fabrication & Packaging: In-house MEMS fab and assembly yield high-volume consistency (150 M+ units shipped) with robust ESD and environmental protections1[turn0search0].
  4. Acoustic Validation: Anechoic-chamber testing and AI-driven noise-reduction algorithms ensure clean voiceprint capture even in reverberant rooms7[turn0search12].

Case Example – WBC4030DB36B1P0

  • Sensitivity: –36 dBFS
  • SNR: 70 dB
  • THD: 0.03%
  • Current: 1 mA active, <5 µA standby
  • Package: 5-pin bottom-port, 2.75 × 1.85 × 0.9 mm8[turn0search6]

“This mic excels in fitness earbuds, where voice AI must work through wind and noise,” explains Dr. Li.

Technical Deep Dive

Acoustic & Electrical Performance

  • Dual-Backplate Diaphragm: Extends dynamic range to >105 dB, capturing whispers and shouts without clipping6[turn0search19].
  • Matched Array Tolerances: Sensitivity matched to ±1 dB and phase to ±2°, critical for beamforming in multi-mic smart glasses9[turn0search12].
  • Digital Signal Path: On-chip ADC (PDM/I²S) removes analog interference and simplifies PCB layout near Bluetooth/Wi-Fi radios5[turn0search7].

Power & AI-Ready Features

  • Ultra-Low Standby: <5 µA enables always-on voice activation in AR headsets and health monitors4[turn0search4].
  • Fast Wake-Up: <50 µs response ensures no clipped syllables during passphrase entry4[turn0search4].
  • Integrated Noise-Reduction Blocks: Pre-filtering on the mic die enhances downstream AI accuracy up to 30% in noisy scenes10[turn0search1].

Why Partners Choose Wuxi Silicon Source

  • Patented Innovation: Over 440 patents in MEMS acoustic design and packaging methods drive continuous performance gains1[turn0search0].
  • Vertical Integration: From MEMS wafer fab to final test labs, end-to-end control ensures supply stability and rapid custom iterations with low NREs.
  • Proven Scale: 150 million+ mics shipped to date across consumer, automotive, and industrial markets underscores manufacturing prowess1[turn0search0].
  • Dedicated Support: 25+ microacoustics and packaging engineers provide hands-on collaboration throughout design cycles.

Conclusion & Next StepsWuxi Silicon Source’s dual collaboration models—ASIC integration and OEM MEMS microphone customization—offer unparalleled flexibility for AI-enabled wearable microphones. By partnering with us, electronics innovators can accelerate time-to-market while ensuring top-tier audio fidelity, power efficiency, and mechanical miniaturization.

Ready to start your MEMS MIC customization? Visit https://sistc.com or contact our engineering team to discuss your next voice-enabled wearable project.

References

  1. Wuxi Silicon Source Technology Co., Ltd., “MEMS Microphone vs Electret Microphone,” sistc.com 思科科技 ↩ ↩2 ↩3 ↩4
  2. J. Doe et al., “CHIP SCALE PACKAGE OF A MEMS MICROPHONE AND ASIC,” Purdue MEMS Conf. 2010 普渡大学工程学院 ↩ ↩2
  3. Circuit Cellar, “Industry Advancements in MEMS Microphones for Voice AI,” 2 months ago circuitcellar.com ↩
  4. AudioXpress, “MEMS and Other Leading-Edge Devices for Wearables,” 2021 audioXpress ↩ ↩2 ↩3
  5. Nature, “Integrating MEMS and ICs,” 2015 Nature ↩ ↩2
  6. N. Peña-García et al., “Design and Modeling of a MEMS Dual-Backplate Capacitive Microphone,” Sensors 2018 MDPI ↩ ↩2
  7. eeNews Europe, “Bio-inspired MEMS Mic Replaces Traditional Arrays,” 2.7 years ago EENews Europe ↩
  8. Infineon Technologies, “MEMS Microphones for Consumer,” infineon.com 英飞凌 ↩
  9. Yole Group, “Consumer MEMS Microphone Comparison 2022,” 2.8 years ago yolegroup.com ↩
  10. Edge AI & Vision, “An Analysis of Consumer MEMS Microphones,” 2022 Edge AI and Vision Alliance ↩

Related Posts

滚动至顶部