Key Features

1. 4-Channel Digital MEMS Microphone Array

The module integrates four digital MEMS microphones with synchronized audio acquisition capability.

Key advantages:

• 4-channel digital microphone input
• High-quality multi-channel audio capture
• Digital signal processing architecture
• Low-noise voice acquisition
• Suitable for far-field voice interaction

The multi-microphone design improves voice clarity by capturing spatial audio information and enabling advanced acoustic algorithms.

2. Integrated DSP Audio Processing Platform

The GYSY-6239C-D360 integrates a powerful DSP audio processing engine featuring:

• 32-bit RISC processor
• Up to 240MHz operating frequency
• Hardware acceleration for audio processing
• AI noise reduction algorithm support

The built-in DSP architecture reduces system complexity and provides a complete audio front-end solution for embedded applications.

3. AI Noise Reduction and Voice Enhancement

The module utilizes intelligent audio processing algorithms to suppress unwanted environmental noise and enhance human speech.

Supported noise environments include:

• Traffic noise
• Motor and machine noise
• Fan noise
• Background conversation
• Outdoor environmental noise

The AI noise suppression algorithm can achieve up to -65dB noise reduction performance depending on application conditions and system configuration.

4. Advanced Acoustic Algorithms

Acoustic Echo Cancellation (AEC)

The built-in AEC algorithm eliminates echo interference caused by speakers and improves full-duplex voice communication quality.

Applications:

• Video conferencing devices
• Smart displays
• Voice terminals

Beamforming Technology

Multi-microphone beamforming improves directional voice pickup by enhancing the target speaker signal while reducing surrounding noise.

Benefits:

• Improved speech recognition accuracy
• Better far-field voice capture
• Enhanced user experience

Noise Suppression (NS)

Suppresses stationary and non-stationary background noise for clearer communication.

Automatic Voice Enhancement

Optimizes voice signals and maintains natural speech quality under different acoustic conditions.

Digital Audio Interfaces

USB 2.0 Audio Interface

The module supports USB 2.0 standard communication with integrated PHY protocol.

Advantages:

• Plug-and-play USB audio solution
• Compatible with PC systems
• Compatible with embedded platforms
• Supports OTG devices

PCM / I2S Digital Output

Supported interfaces:

• PCM digital audio
• I2S audio interface

The module can output independent microphone channel audio data for advanced host-side processing and customization.

Technical Specifications

Application Areas

AI Voice Interaction Devices

Suitable for:

• Smart speakers
• AI assistants
• Voice-controlled terminals
• Smart home devices

Smart Conference Systems

Applications:

• Conference microphones
• Video conferencing terminals
• Meeting room voice systems

Industrial Voice Control

Suitable for:

• Industrial equipment
• Intelligent control panels
• Factory communication systems

Smart Transportation

Applications:

• Vehicle voice terminals
• Intelligent cockpit systems
• Transportation communication equipment

Flexible Development and Customization

The GYSY-6239C-D360 supports secondary development and parameter configuration.

Customers can customize:

• Microphone gain settings
• Noise reduction parameters
• Audio processing configuration
• Host-side algorithm integration

Compatible development environments:

• Android
• Windows
• Linux

Acoustic Design Recommendations

For optimal acoustic performance:

• Keep microphones away from speakers
• Separate microphone and speaker acoustic chambers
• Avoid vibration sources such as fans and motors
• Use acoustic isolation materials when necessary

Proper mechanical and acoustic design improves:

• Voice pickup distance
• AEC performance
• Noise reduction effectiveness

Reliability Performance

The module supports industrial reliability testing including:

• Thermal shock testing
• High-temperature operation testing
• Low-temperature operation testing
• Temperature and humidity testing
• Mechanical shock testing
• Vibration testing
• Drop testing
• Reflow testing
• ESD testing

Why Choose SISTC Digital Microphone Array Solutions?

With more than 15 years of experience in MEMS microphone design and acoustic technology, SISTC provides complete audio solutions for global customers.

Our capabilities include:

✔ MEMS microphone array design
✔ DSP audio processing
✔ AI noise reduction algorithms
✔ Beamforming technology
✔ Acoustic optimization
✔ OEM/ODM customization

SISTC helps customers develop next-generation AI voice products with superior audio performance and reliable integration.

OEM / ODM Services

SISTC provides customized microphone solutions:

• 2/4/8/16 microphone array designs
• USB / I2S / PDM interfaces
• Acoustic tuning services
• Algorithm optimization
• Hardware customization
• Firmware support