4-Mic Linear Far-Field Microphone Array Module with USB UAC Interface-GYKS-4M-Q360-LP

4-Mic Linear Far-Field Microphone Array Module with USB UAC Interface-GYKS-4M-Q360-LP

Short Description

The GYKS-4M-Q360-LP 4-Mic Linear Far-Field Microphone Array Module is a high-performance USB audio capture solution featuring four high-sensitivity MEMS microphones arranged in a linear equal-distance array structure.

Designed for AI voice interaction, smart conferencing devices, intelligent terminals, robots, smart home appliances, and industrial voice control applications, this microphone array module integrates advanced acoustic algorithms including AEC (Acoustic Echo Cancellation), Beamforming, Noise Suppression, and Automatic Gain Control (AGC) to achieve clear voice pickup in complex acoustic environments.

With a far-field pickup distance of 6–10 meters, USB Audio Class 1.0 (UAC 1.0) compatibility, and low-power operation, the GYKS-4M-Q360-LP provides an easy-to-integrate audio interface for AI-enabled hardware platforms.

4-Microphone Linear Array for Far-Field Voice Capture

The GYKS-4M-Q360-LP adopts a linear 4-MEMS microphone array architecture, with microphones arranged at equal intervals to improve spatial audio acquisition capability.

Compared with traditional single microphone solutions, the 4-microphone array provides stronger directional voice pickup performance through intelligent signal processing algorithms, effectively improving speech clarity and reducing environmental noise.

The module supports USB digital audio output, allowing direct connection with embedded systems, PCs, AI terminals, smart displays, conference devices, and voice-controlled equipment.


Key Features

High-Performance Far-Field Voice Pickup

  • 4-channel MEMS microphone linear array design
  • Pickup distance up to 6–10 meters
  • High sensitivity: -30 dB FS
  • High signal-to-noise ratio: 64 dB(A)
  • Maximum acoustic overload point: 120 dB SPL

The module provides stable voice acquisition performance in open environments, suitable for long-distance human-machine interaction.


Advanced Audio Algorithms

The integrated audio processing algorithms improve speech intelligibility and user experience:

Acoustic Echo Cancellation (AEC)

Removes speaker feedback and echo interference in voice communication scenarios, improving full-duplex conversation quality.

Beamforming (BF)

Uses multi-microphone spatial processing technology to enhance sound from the target direction while reducing unwanted sounds from other directions.

Noise Suppression (NS)

Suppresses background noise including:

  • Environmental noise
  • Fan noise
  • Machine noise
  • Office background noise

Automatic Gain Control (AGC)

Automatically adjusts microphone gain according to voice intensity and distance, maintaining consistent audio output levels.


Hardware Features

  • 4-MEMS linear microphone array structure
  • USB Audio Class 1.0 (UAC 1.0) supported
  • USB Control interface for debugging and parameter configuration
  • Supports USB HUB connection with camera devices
  • Compact linear microphone PCB design
  • Plug-and-play USB audio solution

Technical Specifications

ParameterSpecification
Product ModelGYKS-4M-Q360-LP
Microphone TypeLinear Equal-Distance Array Microphone
Number of Microphones4 MEMS Microphone Array
Pickup Distance6–10 meters
Audio Sampling Rate16KHz / 48KHz @16bit
Sensitivity-30 dB FS
Signal-to-Noise Ratio (SNR)64 dB(A)
Acoustic Overload Point (AOP)120 dB SPL
Audio InterfaceUSB Digital Audio
USB ProtocolUSB Audio Class 1.0 (UAC 1.0)
USB Debug FunctionSupported
Power SupplyUSB 5V ±5%
Power Consumption1W @5V, 160mA Max
ConnectorUSB 5-pin 1.25mm GH Vertical Connector
Main PCB Size100mm × 20mm
Microphone PCB Size115mm × 6mm
Array StructureLinear 4-Microphone Array

Algorithm Functions

FunctionSupport
Acoustic Echo Cancellation (AEC)✔ Supported
Beamforming (BF)✔ Supported
Noise Suppression (NS)✔ Supported
Automatic Gain Control (AGC)✔ Supported
Voice Enhancement✔ Supported
Far-field Voice Pickup✔ Supported

Application Fields

AI Voice Interaction Devices

Suitable for:

  • AI smart speakers
  • Voice assistants
  • Smart home controllers
  • Intelligent terminals

Video Conference Equipment

Applications:

  • Conference microphones
  • Meeting room terminals
  • USB conference devices
  • Remote collaboration systems

Smart Display & IoT Devices

Ideal for:

  • Smart displays
  • Interactive kiosks
  • Digital signage
  • Home automation systems

Robotics & Intelligent Equipment

Used in:

  • Service robots
  • Educational robots
  • Industrial voice terminals
  • Human-machine interaction devices

Why Choose SISTC 4-Mic Array Module?

Professional MEMS Audio Technology Provider

With more than 15 years of experience in MEMS microphone design and acoustic technology, SISTC provides complete microphone solutions from MEMS sensor integration, hardware design, acoustic algorithms, and system optimization.

Our microphone array solutions combine:

  • High-performance MEMS microphone technology
  • Advanced beamforming algorithms
  • Noise reduction technology
  • Flexible OEM/ODM customization capability

to help global customers develop next-generation AI audio products.


OEM / ODM Customization

SISTC provides customized microphone array solutions including:

  • Microphone number customization (2/4/8/16+ channels)
  • PCB structure optimization
  • Acoustic tuning
  • Algorithm parameter adjustment
  • USB / I2S / PDM interface customization
  • Firmware optimization

Contact SISTC for customized far-field voice pickup solutions.

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