English 
Chinese As intelligence becomes the mainstream demand in electronics, Artificial Intelligence (AI) continues to move closer to the edge and user side. In automotive, smart living, and industrial control, Microcontroller Units (MCUs) are facing higher requirements in terms of performance, power efficiency, and ecosystem readiness.
Recently, China Electronics News announced the list of “2025 Edge AI MCU Excellence Cases”, and XMOS xcore.ai series edge multicore controllers were successfully selected thanks to their outstanding performance, low power consumption, and flexibility.
At Wuxi Silicon Source Technology Co., Ltd. (SISTC), we see this milestone as a strong signal of where the industry is heading. MEMS MIC technology, combined with advanced edge AI processing, is becoming a critical enabler for applications such as:
- Smart home devices and voice assistants
- Automotive audio and in-cabin voice interfaces
- Industrial voice control and monitoring systems
- Consumer electronics and immersive audio experiences
Why xcore.ai Matters for Audio and MEMS Microphones
XMOS is the first in the world to integrate an AI accelerator, high-performance DSP, control MCU, and flexible I/O into a single chip. The xcore.ai processors provide high real-time performance with ultra-low latency, ensuring near-perfect transmission of multi-channel audio streams. They can simultaneously support up to 32 audio channels with PCM encoding, enabling high-resolution audio playback, advanced mixing, and intelligent audio processing.
For SISTC MEMS microphones, this ecosystem creates new opportunities. Paired with xcore.ai, our MEMS MICs deliver:
- AI-powered noise reduction for crystal-clear voice capture
- Acoustic environment optimization for conferencing and smart devices
- Low-latency voice pickup for real-time communication
- Enhanced signal quality in both consumer and industrial-grade applications
You can explore our MEMS microphone portfolio here: MEMS Microphone Products.
Next-Gen Smart Audio Applications
With xcore.ai and SISTC MEMS MIC technologies, the following innovations are becoming a reality:
- 3D Spatial Audio: For gaming headsets, conferencing headphones, and immersive earphones.
- AI Noise Suppression: For smart doorbells, intercoms, industrial hands-free communication, and voice-enabled monitoring devices.
- Multimodal AI Sensor Fusion: For smart video doorbells, surveillance devices, license plate recognition systems, and edge intelligence hubs.
Industry Recognition and Future Outlook
“Being recognized as a 2025 Edge AI MCU Excellence Case reflects the strong endorsement of industry experts and engineers,” said Tao Mou, APAC Sales & Marketing Director of XMOS. “With the xcore platform and complete xcore-voice intelligent audio solutions, we aim to empower high-quality audio systems, advanced AI human-machine interfaces, and a wide range of edge intelligence applications.”
At SISTC, we are committed to advancing audio intelligence through our MEMS microphone technology and partnerships with leading semiconductor innovators like XMOS. Together, we bring the industry closer to a future of smarter, more immersive, and more responsive audio solutions.
👉 Learn more about our MEMS MIC solutions: https://sistc.com/contact-us/
