In an era where immersive sound and intelligent audio processing define user engagement, audio system designers demand components that deliver crystal-clear capture, ultra-low noise, and seamless integration. As an official XMOS partner, Wuxi Silicon Source Technology Co., Ltd. (SISTC) leverages XMOS’s industry-leading audio SoCs alongside its own high-precision MEMS microphones—optimized for everything from spatial audio headsets to AI-powered sensor hubs.
1. 3D Spatial Audio: Elevate Immersion and Safety
The rise of 3D immersive spatial audio—whether in digital headphones, AR/VR headsets, or smart earbuds—relies on microphones that can faithfully capture environmental cues. Through our XMOS collaboration, SISTC’s Digital MEMS Microphones offer:
- Seamless PDM-to-I²S bridging into XMOS audio cores for advanced beamforming
- High Signal-to-Noise Ratio (SNR) for pinpoint spatial localization
- Compact footprint (<3 mm²) to fit next-gen earbud form factors
This turnkey combination—XMOS’s multichannel DSP and SISTC’s ultra-clean mic front-end—lets you deliver truly 3D soundscapes with minimal power and latency.
2. High-Quality, Low-Latency Sound Cards for Gaming & Live Streaming
Professional-grade audio interfaces demand low latency and real-time DSP. Our partnership with XMOS enables direct integration of SISTC’s Analog MEMS Microphones into XMOS USB audio controllers, delivering:
- Sub-1 ms audio pass-through for lag-free voice and instrument capture
- Low total harmonic distortion (THD) and wide dynamic range
- Simplified reference designs and software stacks
Equip your USB or PCIe sound cards with this XMOS-backed platform to captivate gamers, podcasters, and live-streamers alike.
3. AI-Driven Noise Reduction: Crystal-Clear Voice in Any Environment
Deep neural-network DNN denoising hinges on having a pristine input signal. SISTC’s high-SNR MEMS microphones—paired with XMOS’s flexible Xcore processors—deliver that clean signal even in bustling factories or windy outdoors. Highlights include:
- On-chip PDM-to-PCM conversion feeding directly into real-time AI pipelines
- Robust ESD and environmental protection for industrial deployments
- Ready-made XMOS application examples for voice-activated assistants
This integrated solution accelerates your time-to-market for any noise-robust voice interface.
4. Software-Defined SoC & Multimodal AI Sensor Hubs
For edge-AI applications—where audio, vision, and motion data converge—the XMOS × SISTC combo shines. Use SISTC’s microphone arrays alongside XMOS multicore modules to achieve:
- Advanced beamforming and echo cancellation in a single, power-efficient package
- I²S over TDM and gigabit-rate Ethernet for AES-67 streaming
- Open-source XMOS firmware examples for rapid prototyping
Embed these solutions in your AI Sensor Hubs to preprocess audio locally—safeguarding privacy while offloading only high-level data to the cloud.
5. AES67-Compliant Ethernet Audio Endpoints
Interoperability in pro-audio and broadcast installations is paramount. SISTC’s MEMS-based array modules, validated on XMOS AES67 reference designs, provide:
- Tight clock synchronization and sub-millisecond latency
- Plug-and-play compatibility with Dante™, CobraNet®, and Livewire™
- Single-cable PoE for power and data
Ideal for public-address, intercom, and background-music systems in retail, transportation hubs, and corporate campuses.
Why Choose SISTC & XMOS Together?
- Proven, Turnkey Solutions: Pre-validated microphone + SoC reference designs to speed your development.
- Comprehensive Support: Joint datasheets, application notes, and firmware examples.
- Global Reach: Fast sampling and production-scale delivery from Wuxi.
Ready to accelerate your audio projects?
→ Get a quote or request samples at sistc.com/product-category/mems-microphone/
→ Contact our audio experts at info@sistc.com
Elevate every listening experience with XMOS-enabled SISTC MEMS Microphones—where precision meets innovation.
